Low pressure injection molding waterproof process of industrial circular connector to improve waterproof level

The low pressure injection molding process is a kind of packaging process that uses a very low injection pressure to inject the hot-melt adhesive into the mold and quickly solidify it (1-50 seconds). With the excellent sealing performance and excellent physical and chemical properties of the hot-melt adhesive material, it can achieve the functions of insulation, temperature resistance, impact resistance, shock absorption, moisture-proof, water-proof, dust-proof, chemical corrosion resistance, etc. It plays a good role in protecting electronic components. Compared with the traditional filling and sealing process (such as two-component epoxy / polyurethane filling and sealing), the low-pressure injection molding process is not only environmentally friendly, but also can greatly improve the production efficiency to help reduce the total production cost.