waterproof connector notes

 In recent years, the development trend of electronic semiconductors continues to pursue miniaturization, high efficiency, low consumption and low cost. Because through Silicon Via (TSV) uses laser to drill holes in wafers or chips, and then fills conductive materials into the holes to form conductive paths, which vertically connect the upper and lower surfaces of the same chip to facilitate the stacking of multiple chips, this technology is called three-dimensional integrated circuit (3D IC) construction technology. Compared with the previous multi-chip packaging, three-dimensional packaging technology can shorten the signal transmission path through stacking of multiple chips, make the signal transmission faster, and reduce the space occupied by the package. These advantages make 3D IC become the technology developed by various semiconductor manufacturers, and also become the key to maintain the competitiveness of the domestic IC manufacturing and sealing industry.